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HS Code
(HS 2012)
Description
2012 2013 2014 2015 2016 2017 2018 2019
2020 and
subsequent
years
Annex 1
Schedule of Tariff Commitments
Australia
8486.40.10 ---Machines and apparatus, as follows: (a) machine-
tools for working material by removal of material, by
the processes specified in 8456 (including laser or
other light or photon beam, ionic-beam or electron
beam processes); (b) optical and other microscopes;
(c) drawing or marking-out instruments; (d) die attach
apparatus, tape automated bonders, and wire
bonders for the assembly of semiconductors; (e)
encapsulation equipment for the assembly of
semiconductors; (f) for bending, folding and
straightening semiconductor leads; (g) soldering,
brazing or welding machines, of a kind described in
8515, for working metal, incorporating a computer
control; (h) industrial robots, being automated
machines for transport, handling and storage of
semiconductor wafers, wafer cassettes or wafer
boxes; (ij) injection or compression moulds for rubber
or plastics for the manufacture of semiconductor
devices
0% 0% 0% 0% 0% 0% 0% 0% 0%
8486.40.20 ---Machines and apparatus, NSA, which, but for the
operation of Note 9(D) to this Chapter, would be
classified in 8543.70.00
0% 0% 0% 0% 0% 0% 0% 0% 0%
8486.40.30 ---Machines and apparatus, NSA, which, but for the
operation of Note 9(D) to this Chapter, would be
classified in 8477 or 8480.71.00
0% 0% 0% 0% 0% 0% 0% 0% 0%
8486.40.40 ---Deflash machines for cleaning and removing
contaminants from the metal leads of semiconductor
packages prior to the electroplating process
0% 0% 0% 0% 0% 0% 0% 0% 0%
8486.40.90 ---Other, including machinery for lifting, handling,
loading or unloading of boules, wafers,
semiconductor devices, electronic integrated circuits
and flat panel displays:
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